Signal attenuation or failure caused by oxidation on the contact surfaces of pin header and female header connectors. First, use precision instruments to detect the thickness and distribution of the oxide layer. Then, perform ultrasonic cleaning of the contacts using anhydrous ethanol or specialized electronic cleaning agents to remove surface oxides and contaminants. For areas with severe localized oxidation, a micron-level polishing process can be applied to restore the flatness of the plating layer, combined with inert gas-protected welding techniques to prevent secondary oxidation.

For prevention, prioritize contact designs with gold plating thickness ≥0.2μm or silver plating, and verify the corrosion resistance of the plating through salt spray testing. In high-temperature and high-humidity application environments, it is recommended to apply a nano-level anti-oxidation coating during connector assembly, along with periodic mating maintenance (e.g., cleaning contacts after every 5,000 mating cycles) to maintain stable contact resistance. For contacts already showing signs of oxidation, electrochemical reduction can be used to restore conductivity. After treatment, contact resistance testing and insertion/extraction force verification must be performed again.