The FPC connector coplanarity inspection process follows a standardized operation model, primarily consisting of three stages: preprocessing, inspection execution, and data analysis. Before the operation, samples must be cleaned and dusted to ensure the surface is free from contaminants that could affect measurement accuracy. The connector is then fixed in a dedicated fixture, accurately positioned through vacuum adsorption or mechanical clamping.

During the inspection stage, an optical projection measurement system is primarily used to perform a two-dimensional planar scan of the pin array, generating a real-time heat map of contact point height distribution. For miniaturized or high-density packaged products, the system switches to laser 3D scanning mode to obtain submicron-level topography data.

Throughout the inspection, environmental parameters such as temperature and humidity are synchronously recorded. The software automatically compares the results against a preset tolerance range of 0.05 mm and highlights any out-of-tolerance points in red.

Upon completing the basic inspection, the system automatically generates a quality report containing key parameters such as maximum deviation and standard deviation, providing data support for subsequent process adjustments. This process places particular emphasis on the coordinated use of fixture calibration and compensation algorithms to ensure that the inspection results meet the requirements for Class 2 products specified in the IPC-A-610G standard.